Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus

ABSTRACT

A conventional substrate processing apparatus for generating plasma cannot generate plasma with high density and thus throughput of substrate processing is low. In order to solve this problem, provided is a substrate processing apparatus including a reaction vessel having a tubular shape and provided with a coil installed at an outer circumference thereof; a cover installed at a first end of the reaction vessel; a gas introduction port installed at the cover; a first plate installed between the gas introduction port and an upper end of the coil; a second plate installed between the first plate and the upper end of the coil; a substrate processing chamber installed at a second end of the reaction vessel; and a gas exhaust part connected to the substrate processing chamber.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. §119 of Japanese Patent Application No. 2010-267073, filed onNov. 30, 2010, and No. 2011-225617, filed on Oct. 13, 2011, in theJapanese Patent Office, the entire contents of which are herebyincorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate processing apparatus forgenerating plasma and processing a substrate using the plasma, a methodof manufacturing a semiconductor device, and a baffle structure used inthe substrate processing apparatus.

2. Description of the Related Art

When a semiconductor device is manufactured, various processes areperformed using plasma. One method of generating plasma is known as aninductive coupling plasma (ICP) method. In the ICP method, radiofrequency power is supplied to a coil to generate an electric field in aplasma generating space so that a gas supplied into the plasmagenerating space is in a plasma state. A substrate processing apparatususing the ICP method may be, for example, an apparatus disclosed inPatent Document 1.

PRIOR ART DOCUMENT

[Patent Document]

-   1. Japanese Patent Laid-open Publication No. 2003-77893

SUMMARY OF THE INVENTION

However, a conventional substrate processing apparatus cannot easilygenerate plasma with a high density, and as a result, throughput ofsubstrate processing is low.

In order to solve these problems, an object of the present invention isto provide a substrate processing apparatus capable of processing asubstrate with high throughput using plasma, a method of manufacturing asemiconductor device, and a baffle structure used in the substrateprocessing apparatus.

In order to accomplish the above object, the present invention providesa substrate processing apparatus including: a reaction vessel having atubular shape and provided with a coil installed at an outercircumference thereof; a cover installed at a first end of the reactionvessel; a gas introduction port installed at the cover; a first plateinstalled between the gas introduction port and an upper end of thecoil; a second plate installed between the first plate and the upper endof the coil; a substrate processing chamber installed at a second end ofthe reaction vessel; and a gas exhaust part connected to the substrateprocessing chamber.

In addition, the present invention provides a method of manufacturing asemiconductor device using a substrate processing apparatus including: areaction vessel having a tubular shape and provided with a coilinstalled at an outer circumference thereof; a cover installed at afirst end of the reaction vessel; a gas introduction port installed atthe cover; a first plate installed between the gas introduction port andan upper end of the coil; a second plate installed between the firstplate and the upper end of the coil; a substrate processing chamberinstalled at a second end of the reaction vessel; and a gas exhaust partconnected to the substrate processing chamber, the method including:inducing a gas introduced through the gas introduction port about thecoil via the first and second plates; exciting the gas into a plasmastate by the coil and processing the substrate placed in the substrateprocessing chamber with the gas; and exhausting the gas through the gasexhaust part.

Further, the present invention provides a baffle structure using asubstrate processing apparatus including: a reaction vessel having atubular shape and provided with a coil installed at an outercircumference thereof; a cover installed at a first end of the reactionvessel; a gas introduction port installed at the cover; a substrateprocessing chamber installed at a second end of the reaction vessel; anda gas exhaust part connected to the substrate processing chamber, thebaffle structure comprising: a first plate and a second plate stackedbetween the gas introduction port and an upper end of the coil.

According to the present invention, substrate processing can beperformed with high throughput.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic horizontal cross-sectional view for explaining anashing apparatus in accordance with an exemplary embodiment of thepresent invention;

FIG. 2 is a schematic vertical cross-sectional view for explaining theashing apparatus in accordance with the exemplary embodiment of thepresent invention;

FIG. 3 is a vertical cross-sectional view for explaining a plasmaprocessing unit included in the ashing apparatus in accordance with theexemplary embodiment of the present invention;

FIGS. 4A and 4B are vertical cross-sectional views for explaining abaffle plate of the plasma processing unit included in the ashingapparatus in accordance with the exemplary embodiment of the presentinvention;

FIGS. 5A and 5B are vertical cross-sectional views for explaining anattachment structure of the baffle plate of the plasma processing unitincluded in the ashing apparatus in accordance with the exemplaryembodiment of the present invention;

FIGS. 6A and 6B are vertical cross-sectional views for explaining a gasflow velocity of the plasma processing unit included in the ashingapparatus in accordance with the exemplary embodiment of the presentinvention;

FIG. 7 is a view for explaining normal discharge limit power; and

FIG. 8 is a flowchart performed in the plasma processing unit includedin the ashing apparatus in accordance with the exemplary embodiment ofthe present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, an exemplary embodiment of the present invention will bedescribed with reference to the accompanying drawings. The presentinvention relates to, for example, a substrate processing method used ina semiconductor manufacturing apparatus, and more particularly, to a dryashing process of generating an reactive gas in a plasma state throughan ICP method and delaminating a predetermined organic thin film (aresist, a resist film) on a substrate surface by a reactive species (areactive active species) having high reactivity obtained therefrom.

In the exemplary embodiment of the present invention, a method ofmanufacturing a semiconductor device and a method of processing asubstrate are implemented by an ashing apparatus used as a semiconductormanufacturing apparatus and a substrate processing apparatus. FIG. 1 isa schematic horizontal cross-sectional view for explaining an ashingapparatus in accordance with an exemplary embodiment of the presentinvention, and FIG. 2 is a schematic vertical cross-sectional view forexplaining the ashing apparatus in accordance with the exemplaryembodiment of the present invention. As shown in FIGS. 1 and 2, anashing apparatus 10 includes an equipment front end module (EFEM) 100, aload lock chamber part 200, a transfer module part, and a processingchamber part 400 used as a processing chamber in which ashing processingis performed.

The EFEM 100 includes front opening unified pods (FOUPs) 110 and 120,and an atmospheric robot 130, which is a first conveyance part,configured to convey a wafer to the load lock chamber from each FOUP. 25wafers are mounted in the FOUP and an arm part of the atmospheric robot130 extracts 5 wafers from the FOUP.

The load lock chamber part 200 includes load lock chambers 250 and 260,and buffer units 210 and 220 configured to hold the wafers 600 (see FIG.3) conveyed from the FOUP in the load lock chambers 250 and 260,respectively. The buffer units 210 and 220 include boats 211 and 221 andindex assemblies 212 and 222 under the boats. The boat 211 and the indexassembly 212 under the boat are simultaneously rotated about a θ axis214. Similarly, the boat 221 and the index assembly 222 under the boatare also simultaneously rotated about a θ axis 224.

The transfer module part 300 includes a transfer module 310 used as aconveyance chamber, and the load lock chambers 250 and 260 are installedat the transfer module 310 via gate valves 311 and 312. A vacuum armrobot unit 320 used as a second conveyance part is installed at thetransfer module 310.

The processing chamber part 400 includes plasma processing units 410 and420 used as a processing chamber, and plasma generating chambers 430 and440 installed at an upper part thereof. The plasma processing units 410and 420 are installed at the transfer module 310 via gate valves 313 and314.

The plasma processing units 410 and 420 include susceptor tables 411 and421 on which the wafers 600 are placed. Lifter pins 413 and 423 areinstalled to pass through the susceptor tables 411 and 421. The lifterpins 413 and 423 move vertically in Z-axis directions 412 and 422.

The plasma generating chambers 430 and 440 include reaction vessels 431and 441 (see FIG. 3), respectively. Resonance coils, which will bedescribed later, are installed outside the reaction vessels 431 and 441.Radio frequency power is applied to the resonance coils to generate areactive gas for ashing processing introduced from a gas introductionport, which will be described later, in a plasma state. Resists on thewafers 600 placed on the susceptor tables 411 and 421 areashing-processed using the plasma (plasma-processed).

In addition, the apparatus includes a controller 500 electricallyconnected to the components. The controller 500 controls operations ofthe components.

In the ashing apparatus 10 as configured above, the wafers 600 areconveyed into the load lock chambers 250 and 260 from the FOUPs 110 and120. At this time, as shown in FIG. 2, the atmospheric robot 130 storestweezers in a pod of the FOUP and places 5 wafers on the tweezers. Here,according to positions of the extracted wafers in a height direction,the controller 500 moves the tweezers and arm of the atmospheric robotvertically. After placing the wafers on the tweezers, the atmosphericconveyance robot 130 is rotated in a θ axis direction 131, and thewafers are mounted on the boats 211 and 221 of the buffer units 210 and220, respectively. At this time, as the boats 211 and 221 are operatedin a Z-axis direction 230, the boats 211 and 221 receive 25 wafers 600from the atmospheric conveyance robot 130. After receiving the 25wafers, the controller 500 operates the boats 211 and 221 in the Z-axisdirection such that the wafer disposed at the lowermost layer of theboats 211 and 221 corresponds to a height position of the transfermodule part 300.

In the load lock chambers 250 and 260, the wafers 600 held in the loadlock chambers 250 and 260 by the buffer units 210 and 220 are mounted onfingers 312 of the vacuum arm robot unit 320. The vacuum arm robot unit320 is rotated in a θ axis direction 325, and the fingers extend in aY-axis direction 326 to transfer the wafers onto the susceptor tables411 and 421 in the plasma processing units 410 and 420.

Here, an operation of the ashing apparatus 10 when the wafers 600 aretransferred onto the susceptor tables 411 and 421 from the fingers 321will be described.

The wafers 600 are transferred onto the susceptor tables 411 and 421through cooperation of the fingers 321 of the vacuum arm robot unit 320and the lifter pins 413 and 423. In addition, by means of a reverseoperation, the processed wafers 600 are transferred onto the bufferunits 210 and 220 in the load lock chambers 250 and 260 from thesusceptor tables 411 and 421 by the vacuum arm robot unit 320.

FIG. 3 is a view specifically showing the plasma processing unit 410. Inaddition, the plasma processing unit 420 has the same configuration asthe plasma processing unit 410. Further, the susceptor table 421included in the plasma processing unit 420 has the same configuration asthe susceptor table 411.

The plasma processing unit 410 is an ICP type of plasma processing unitthat performs ashing of a semiconductor substrate or a semiconductordevice through dry processing. As shown in FIG. 3, the plasma processingunit 410 includes a plasma generating chamber 430 configured to generateplasma, a processing chamber 445 configured to accommodate wafers 600such as a semiconductor substrate, a radio frequency power supply 444configured to supply radio frequency power to the plasma generatingchamber 430 (in particular, a resonance coil 432), and a frequencymatching box 446 configured to control an oscillation frequency of theradio frequency power supply 444. For example, the plasma processingunit 420 is configured by disposing the plasma generating chamber 430 ona horizontal base plate 448, which is a cradle, and disposing theprocessing chamber 445 under the base plate 448. In addition, a spiralresonator is constituted by a resonance coil 432 and an outer shield452.

The plasma generating chamber 430 is constituted by a reaction vessel431, which can be decompressed and into which a reactive gas for plasmais supplied, the resonance coil 432 is wound on an outer circumferenceof the reaction vessel, and the outer shield 452 disposed at an outercircumference of the resonance coil 432 and electrically grounded.

The reaction vessel 431 is a chamber having a tubular shape and formedof high purity quartz glass or ceramics. The reaction vessel 431 isdisposed to have a vertical axis, and has upper and lower endshermetically sealed by a top plate 454 and the processing chamber 445installed at an opposite side of the top plate 454. The top plate 454 issupported by a flange 431 b of the reaction vessel 431 and an upper endof the outer shield 452.

The top plate 454 includes a cover 454 a configured to block one end ofthe reactive vessel 431, and a support 454 b configured to support thecover 454 a. The cover 454 a is an inner surface from a portion incontact with a front end 431 a in a radial direction, and the support454 b is a portion supported by the flange 431 b and the outer shield452. A gas introduction port 433 is installed substantially at a centerof the cover 454 a. An O-ring 453 is installed at an outer circumferenceof the front end 431 a between the flange 431 b and the support 454 b tohermetically seal the plasma generating chamber 430.

A susceptor 459 supported by a plurality of (for example, 4) columns 461is installed at a bottom surface of the processing chamber 445 under thereaction vessel 431. A heater 463, which is a heating part configured toheat the susceptor table 411 and the wafer on the susceptor, isinstalled at the susceptor 459. An exhaust plate 465 is disposed underthe susceptor 459. The exhaust plate 465 is supported by a bottom plate469 via a guide shaft 467, and the bottom plate 469 is hermeticallyinstalled at a lower surface of the processing chamber 445. An elevationplate 471 is installed to elevate the guide shaft 467 as a guide. Theelevation plate 471 supports at least three lifter pins 413.

As shown in FIG. 3, the lifter pin 413 passes through the susceptortable 411 of the susceptor 459. In addition, a support 414 configured tosupport the wafer 600 is installed at an apex of the lifter pin 413. Thesupport 414 extends in a center direction of the susceptor 459. As thelifter pin 413 is elevated, the wafer 600 is placed on the susceptortable 411, or raised from the susceptor table 411. An elevation shaft473 of an elevation drive part (not shown) is connected to the elevationplate 471 via the bottom plate 469. As the elevation drive part elevatesthe elevation shaft 473, the support 414 is raised via the elevationplate 471 and the lifter pin 413. In addition, in FIG. 3, the lifter pin413 is shown in a state in which the support part 414 is installed.

A baffle ring 458 is installed between the susceptor 459 and the exhaustplate 465. A first exhaust chamber 474 is defined by the baffle ring458, the susceptor 459 and the exhaust plate 465. The baffle ring 458having a cylindrical shape has a plurality of vent holes, which areuniformly installed. Accordingly, the first exhaust chamber 474 isdistinguished from a processing space of the processing chamber 445. Inaddition, the first exhaust chamber 474 is in communication with theprocessing space by the vent holes. Here, the processing space refers toa space in which a substrate is processed.

An exhaust communication hole 475 is installed in the exhaust plate 465.The first exhaust chamber 474 is in communication with a second exhaustchamber 476 by the exhaust communication hole 475. An exhaust pipe 480is in communication with the second exhaust chamber 476, and a pressureregulation valve 479 and an exhaust pump 481 are installed at theexhaust pipe 480 from an upstream side thereof. A gas exhaust part isconstituted by the exhaust pipe 480, the pressure regulation valve 479and the exhaust pump 481. The gas exhaust part is connected to theprocessing chamber 445 via the second exhaust chamber 476.

On the top plate 454 at an upper part of the reaction vessel 431, a gassupply pipe 455 extending from a gas supply unit 482 and configured tosupply a reactive gas for plasma is installed at the gas introductionport 433. The gas introduction port 433 has a conical shape, a diameterof which is increased as it approaches the processing chamber. The gassupply unit (a gas supply part) 482 includes a gas source 483, a massflow controller 477, which is a flow rate control unit, and anopening/closing valve 478, in sequence from an upstream side thereof.The gas supply unit 482 controls the mass flow controller 477 and theopening/closing valve 478 to control a gas supply amount.

In addition, a pressure in the processing chamber 445 is regulated byadjusting a supply amount and an exhaust amount of the gas using themass flow controller 477 and the pressure regulation valve 479.

FIG. 4A shows surroundings of a baffle plate 460 in accordance with anexemplary embodiment of the present invention, and FIG. 4B showssurroundings of the baffle plate 460 according to Comparative example.

As shown in FIG. 4A, the baffle plate 460 in accordance with anexemplary embodiment of the present invention includes a first baffleplate 460 a and a second baffle plate 460 b, which are formed of, forexample, quartz. The first baffle plate 460 a is disposed in thereaction vessel 431 and installed between an upper end of the resonancecoil 432 and the gas introduction port 433. In addition, the secondbaffle plate 460 b is installed between the first baffle plate 460 a andthe upper end of the resonance coil 432. That is, the first baffle plate460 a and the second baffle plate 460 b are installed between the upperend of the resonance coil 432 and the gas introduction port 433 via aspace to overlap each other. In addition, the first baffle plate 460 aand the second baffle plate 460 b are installed between the susceptortable 411 and the gas introduction port 433.

In addition, the first baffle plate 460 a and the second baffle plate460 b have substantially the same plate shape with no hole. Further, theplates have a shape conforming to an inner circumference of the reactionvessel 431. That is, when the inner circumference of the reaction vessel431 has a circular shape, ends of the baffle plates also have a circularshape. In other words, the baffle plates are configured to form a discshape along the inner circumference of the reaction vessel 431.

According to the above configuration, a flow path of a gas flowingbetween the top plate 454 and the first baffle plate 460 a and a flowpath of a gas flowing between the reaction vessel 431 and the end of thebaffle plate along the inner circumference of the reaction vessel 431are formed. Since a gas supplied from the gas introduction port 433 issupplied via the gas flow paths, the gas supplied to the center of thereaction vessel 431 is not concentrated. That is, since the gas issupplied via the first baffle plate 460 a and the second baffle plate460 b, as shown in dotted arrows of FIG. 4A, gas flows are generated,and the gas is substantially vertically dropped at an upper end side ofthe resonance coil 432. Accordingly, there is no loss of the gas.

Meanwhile, as shown in FIG. 4B, the baffle plate 460 in accordance withComparative example is constituted by one baffle plate 460. In thebaffle plate 460 in accordance with Comparative example, as shown indotted arrows in FIG. 4B, a gas flow path is formed toward an outercircumference of the baffle plate 460 from the gas introduction port 433in an inclined direction, and the gas is diffused at an upper end side(line A-A of FIG. 4B) of the resonance coil 432. That is, since the gasis diffused into a region having low electrolysis intensity, weak plasmais generated.

Here, in the case of ICP type plasma generating apparatus, an electricfield for generating plasma is known to be strong as it approaches theresonance coil 432. Accordingly, as the gas is concentrated in a placehaving a strong electric field adjacent to the resonance coil 432,plasma generating efficiency may be increased. In addition, plasma withhigh energy and long lifespan is generated in such a place. That is, asat least two baffle plates 460 a and 460 b are installed, as shown inarrows, the gas flows along an inner wall of the reaction vessel 431adjacent to the resonance coil, and the gas is concentrated in the placehaving a strong electric field adjacent to the resonance coil 432,increasing the plasma generating efficiency. In addition, plasma withhigh energy and long lifespan is generated in such a place.

Next, an attachment structure of the baffle plates 460 a and 460 b willbe described with reference to FIG. 5. FIG. 5 is an enlarged view of thebaffle plates 460 a and 460 b and the top plate 454, explaining theattachment structure of the baffle plates 460 a and 460 b. First, afixing mechanism will be described with reference to FIG. 5A. A bolt 491inserted into the top plate 454 is sequentially inserted into a firstcollar 492 having a hole formed at its center, a fixing hole formed inthe first baffle plate 460 a, a second collar 493 having a hole formedat its center, and a fixing hole formed in the second baffle plate 460b, and fixed by a fixing bolt 494. The first collar 492 is formed of ametal material (for example, an aluminum alloy), and the top plate 454and the first collar 492 are configured to be grounded. At least threefixing mechanisms are installed in a circumferential direction of thebaffle plate 460 at predetermined intervals.

Next, a positional relationship between the baffle plates 460 a and 460b, the top plate 454 and the reaction vessel 431 will be described withreference to FIG. 5B. As shown in FIG. 5B, a distance between the cover454 a of the top plate 454 and a surface of the first baffle plate 460 afacing the cover 454 a is referred to as GAP(a). GAP(a) is set to arange of 1 mm to 5 mm, preferably, 2 mm to 4 mm A distance betweenfacing surfaces of the first baffle plate 460 a and the second baffleplate 460 b is referred to as GAP(b). GAP(b) is set to a range of 30 mmto 50 mm. A distance between an outer circumference of the baffle plate460 and an inner circumference of the reaction vessel is 0.1 to 10 mm.Specifically, the baffle plate has a diameter of 269 mm, which issmaller than a diameter of the substrate, and the reaction vessel 431has an inner diameter of 275 mm.

A distance between the first baffle plate 460 a and the gas introductionport 433 is set such that abnormal discharge does not occur between thefirst baffle plate 460 a and the cover 454 a, in particular, abnormaldischarge does not occur around the gas introduction port 433.

Here, abnormal discharge refers to the following phenomenon. When Ar gasis added to a process gas to enable easy discharge, discharge occursbetween the first baffle plate 460 a and the cover 454 a due toinfluence of an electric field generated from the resonance coil 432. Inparticular, since the process gas may easily stop at a region around thegas introduction port 433, the discharge may easily occur. The dischargemay be caused by addition of Ar gas. Since the Ar gas has a property ofpromoting the discharge, the process gas may be discharged even at adistance in which the electric field generated from the resonance coilis weak.

In the case of the discharge, the following problems may occur. First,since the plasma generated around the gas introduction port 433 entersthe gas supply pipe 455, the gas supply pipe 455 may be etched. Theetching may cause generation of particles. In particular, when the gassupply pipe 455 is made of a metal material, the processing chamber 445may be contaminated with the metal material and exert bad effects on thesubstrate processing. Second, the plasma generated between the firstbaffle plate 460 a and the cover 454 a may contact the O-ring 453,accelerating deterioration of the O-ring 453.

In order to suppress the discharge, the inventors have researched andfound that the discharge is suppressed by increasing a flow velocity ofthe process gas. Specifically, the distance between the first baffleplate 460 a and the cover 454 a is reduced. As a result, a pressurebetween the first baffle plate 460 a and the cover 454 a can beincreased, and thus, the flow velocity of the gas can be increased.

Next, a positional relationship between the second baffle plate 460 band the resonance coil 432 will be described. The second baffle plate460 b is positioned such that a surface of the second baffle plate 460 bfacing the susceptor table 411 is disposed higher than an upper end(line A-A) of the resonance coil 432. In other words, the second baffleplate 460 b is configured to be disposed between the upper end of theresonance coil 432 and the first baffle plate 460 a. As a result, sincethe gas flows around the resonance coil 432, the plasma can beefficiently generated. In addition, diffusion and deactivation of theplasma can be prevented such that as large an amount of active reactivespecies as possible can be supplied to the wafer disposed at adownstream side. As the second baffle plate 460 b approaches the upperend of the resonance coil 432, a volume of the plasma generating regioncan be reduced, and plasma density per unit volume can be increased.Accordingly, as large an amount of active reactive species as possiblecan be transported to the downstream side. The baffle structure isconfigured as described above.

Here, the flow velocity of the gas will be described with reference toFIG. 6. FIG. 6 is a distribution view of a flow velocity. FIG. 6A showsan example using the baffle plate 460 according to Comparative example,in which one baffle plate is set. FIG. 6B shows an example using thebaffle plates 460 according to the embodiment, in which two baffleplates 460 a and 460 b are set. In Comparative example using one baffleplate 460, it will be appreciated that the flow velocity is low aroundthe gas introduction port 433 and high between the baffle plate 460 andthe cover 454 a. In addition, it will be appreciated that the gas staysin a vortex shape. Accordingly, it may be assumed that the gas isabnormally discharged between the baffle plate 460 and the cover 454 a.On the other hand, in the example using two baffle plates 460 inaccordance with the embodiment, it will be appreciated that, since thegas does not stay between the first baffle plate 460 a and the cover 454a, the discharge can be suppressed.

FIG. 7 is a view showing a relationship between RF power, the baffleplate 460 and the discharge. A vertical axis represents RF power appliedto the resonance coil 432. In states in which there is no baffle plate460, one baffle plate 460 is provided and two baffle plates 460 areprovided, normal discharge limit power was measured, respectively. Thenormal discharge limit power means power that abnormal discharge doesnot occur. Process conditions in these states are as follows.Atmosphere: PR-GAS (CH₄: 10%, Ar: 90%), flow rate: 0.2-3.0 slm, andpressure: 50-250 mTorr.

As can be seen from the drawing, in a state in which there is no baffleplate 460, normal discharge up to 1000 W is possible. In addition, in astate in which one baffle plate 460 is provided, normal discharge up to3000 W is possible. Further, in a state in which two baffle plates 460are provided, normal discharge up to 4900 W is possible.

In the case of the ICP type plasma generating apparatus, since theplasma state can be efficiently accomplished as the RF power isincreased, the RF power may be preferably high as long as the abnormaldischarge does not occur. Accordingly, the case of two baffle plates maybe more preferable than the case of no baffle plate or one baffle plate.

A winding diameter, a winding pitch, and the number of windings of theresonance coil 432 are set such that the resonance coil 432 is resonatedin a certain wavelength mode to form a predetermined wavelength ofstanding waves. That is, an electrical length of the resonance coil 432is set to a length corresponding to an integer number of times (onetime, two times, . . . ) a wavelength of a predetermined frequency ofpower supplied from the radio frequency power supply 444, a halfwavelength or a ¼ wavelength. For example, the length of one wavelengthis about 22 m in the case of 13.56 MHz, about 11 m in the case of 27.12MHz, and about 5.5 m in the case of 54.24 MHz. The resonance coil 432 isformed of an insulating material to have a disc shape, and supported bya plurality of supports vertically installed at an upper end surface ofthe base plate 448.

While both ends of the resonance coil 432 are electrically grounded, atleast one end of the resonance coil 432 is grounded via a movable tab462 to minutely adjust the electrical length of the resonance coil whenthe apparatus is initially installed or the process conditions arevaried. Reference numeral 464 of FIG. 3 represents a fixed ground of theother end. In addition, in order to minutely adjust an impedance of theresonance coil 432 when the apparatus is initially installed or theprocess conditions are varied, a power feeding part is constituted by amovable tab 466 between both of the grounded ends of the resonance coil432.

That is, the resonance coil 432 includes ground parts electricallygrounded and formed at both ends thereof, and the power feeding partconfigured to receive power from the radio frequency power supply 444and installed between the ground parts. At least one ground part is avariable ground part, a position of which can be adjusted, and the powerfeeding part is constituted by a variable power feeding part, a positionof which can be adjusted. When the resonance coil 432 includes thevariable ground part and the variable power feeding part, as describedbelow, the process conditions may be more conveniently adjusted byadjusting a resonance frequency and a load impedance of the plasmagenerating chamber 430.

The outer shield 452 is installed to shield leakage of electronic wavesto the outside of the resonance coil 432 and form a capacitance elementneeded to constitute a resonance circuit between the resonance coil 432and the outer shield 453. The outer shield 452 is generally formed of aconductive material such as an aluminum alloy, copper or a copper alloyin a cylindrical shape. The outer shield 452 is disposed to be spaced,for example, 5 to 150 mm from an outer circumference of the resonancecoil 432.

An RF sensor 468 is installed at an output side of the radio frequencypower supply 444 to monitor traveling waves, reflected waves, and so on.The reflected wave power monitored by the RF sensor 468 is input intothe frequency matching box 446. The frequency matching box 446 controlsa frequency to minimize the reflected waves.

The controller 470 corresponds to the controller 500 of FIG. 1, andcontrols the entire ashing apparatus 10 as well as the radio frequencypower supply 444. A display 472, which is a display part, is connectedto the controller 470. The display 472 displays data detected by variousdetection parts installed at the ashing apparatus 10, for example, amonitored result of the reflected wave by the RF sensor 468.

For example, in the case that the process conditions are varied (gasspecies are increased, and so on) during plasma processing when theashing process is performed or the plasma is generated before the ashingprocess, a gas flow rate, a gas mixing ratio and a pressure may bevaried to change the load impedance of the radio frequency power supply444. Even in this case, since the ashing apparatus 10 includes thefrequency matching box 446, the oscillation frequency of the radiofrequency power supply 444 may be adjusted by following variation in thegas flow rate, the gas mixing ratio and the pressure.

Specifically, the following operations are performed. When the plasma isgenerated, the plasma converges at the resonance frequency of theresonance coil 432. At this time, the RF sensor 468 monitors thereflected waves from the resonance coil 432 and transmits the level ofthe monitored reflected waves to the frequency matching box 446. Thefrequency matching box 446 adjusts the oscillation frequency of theradio frequency power supply 444 such that the reflected waves of thereflected wave power are minimized.

Next, a method of manufacturing a semiconductor using a substrateprocessing method (a photo resist removing method) of the presentinvention as one process will be described with reference to FIG. 8.FIG. 8 illustrates a process of manufacturing a semiconductor deviceusing a substrate processing method and an ashing apparatus 10 of thepresent invention.

FIG. 8 illustrates a substrate processing method in accordance with anexemplary embodiment of the present invention as a process of processinga substrate (wafer) 600 using the ashing apparatus 10. In the substrateprocessing method in accordance with the present invention, as shown inFIG. 8, the substrate is processed through a series of processes atleast including a loading process (S100) of loading the substrate into aprocessing chamber, a heating process (S200) of heating the substrate, aprocessing process (S300) of supplying a reactive gas to process thesubstrate, and an unloading process (S400) of unloading the substratefrom the processing chamber.

In the loading process (S100), a wafer 600 on which a resist is appliedis loaded into a processing chamber 445. In the heating process (S200),the wafer 600 loaded into the processing chamber 445 during the loadingprocess (S100) is heated. In the processing process (S300), a reactivegas containing at least a hydrogen element and an argon element issupplied into the processing chamber 445. For example, PR-GAS (a mixedgas of CH₄ and argon) is supplied. In addition, the reactive gassupplied into the processing chamber reaches a plasma state to processthe wafer 600. In the unloading process (S400), the processed wafer 600is unloaded from the processing chamber 445.

Hereinafter, an example of the substrate processing using the ashingapparatus 10 will be described in detail. Operations of the respectiveparts of the ashing apparatus 10 are controlled by a controller 470.

<Loading Process (S100)> In the loading process (S100), fingers 321 of avacuum arm robot 320 convey the wafer 600 into the processing chamber445. That is, the fingers 321 on which the wafer 600 is mounted enterthe processing chamber 445, and place the wafer 600 onto a raised lifterpin 413. A front end of the lifter pin 413 is maintained in a floatingstate from a susceptor table 411. The wafer 600 is delivered onto thelifter pin 413 while floating on the susceptor table 411. At this time,the wafer 600 is held at, for example, room temperature.

<Heating Process (S200)> In the heating process (S200), the wafer 600 isheld in a floating state from the susceptor table 411, and heated by aheater 463 of the susceptor table 411. A temperature of the wafer iscontrolled by a distance between the susceptor table 411 and the wafer600. In the heating process (S200), the temperature of the wafer 600 iswithin a range of 200° C. to 400° C.

<Processing Process (S300)> In the processing process (S300) ofsupplying a reactive gas, the reactive gas (ashing gas) is supplied intoa plasma generating chamber 430 (into a reaction vessel 431) through agas introduction port 433. The supplied reactive gas includes at least ahydrogen element and an argon element.

After satisfying predetermined conditions in the processing chamber 445,the supplied reactive gas reaches a plasma state by a resonance coil432. That is, after supplying the reactive gas in the process ofsupplying the reactive gas, a radio frequency power supply 444 suppliespower to the resonance coil 432 and accelerates free electrons using aninductive magnetic field excited in the resonance coil 432 to collidethe free electrons with gas molecules, exciting the gas molecules togenerate plasma. Then, the substrate processing is performed by thereactive gas in the plasma state, and the resist is removed.

In this embodiment, a reactive gas containing at least a hydrogenelement and an argon element is supplied as the reactive gas used in theprocessing process (S300). Here, while the Ar gas is used, morespecifically, a gas formed by adding at least one dilution gas selectedfrom the group consisting of N₂ gas and He gas to hydrogen may be used.

<Unloading Process (S400)> In the unloading process (S400), aftercompletion of the ashing processing process, the lifter pin 413 israised. The fingers 321 of the vacuum arm robot 320 raise the processedwafer 600 on the lifter pin 413 to convey the wafer 600 to a load lockchamber 210 or a load lock chamber 220 via a transfer chamber part 310.

While the embodiment exemplarily illustrates the ashing processing, thepresent invention is not limited thereto but may be performed in theprocessing using plasma such as etching processing, film modificationprocessing, and film-forming processing.

In addition, while the embodiment exemplarily illustrates an exampleusing two baffle plates, the present invention is not limited theretobut a plurality of baffle plates may be used between an upper end of acoil and a gas introduction port.

As described above, since a gas can flow along an inner wall of thereaction vessel 431, the gas can be supplied into a strong electricfield region and plasma generating efficiency can be increased. Inaddition, plasma with high energy and long lifespan can be generated.Accordingly, the process can be performed at a high ashing rate, andthus, throughput of the entire apparatus can be increased.

The present invention is as described in the following claims andincludes the following Supplementary Notes.

<Supplementary Note1>

A substrate processing apparatus including: a reaction vessel having atubular shape and provided with a coil installed at an outercircumference thereof; a cover installed at a first end of the reactionvessel; a gas introduction port installed at the cover; a first plateinstalled between the gas introduction port and an upper end of thecoil; a second plate installed between the first plate and the upper endof the coil; a substrate processing chamber installed at a second end ofthe reaction vessel; and a gas exhaust part connected to the substrateprocessing chamber.

<Supplementary Note 2>

The substrate processing apparatus according to Supplementary Note 1,further including an O-ring installed at an outer circumference of afront end of the reaction vessel.

<Supplementary Note 3>

A method of manufacturing a semiconductor device using a substrateprocessing apparatus including: a reaction vessel having a tubular shapeand provided with a coil installed at an outer circumference thereof; acover installed at a first end of the reaction vessel; a gasintroduction port installed at the cover; a first plate installedbetween the gas introduction port and an upper end of the coil; a secondplate installed between the first plate and the upper end of the coil; asubstrate processing chamber installed at a second end of the reactionvessel; and a gas exhaust part connected to the substrate processingchamber, the method including: inducing a gas introduced through the gasintroduction port about the coil via the first and second plates;exciting the gas into a plasma state by the coil and processing thesubstrate placed in the substrate processing chamber with the gas; andexhausting the gas through the gas exhaust part.

<Supplementary Note 4>

A baffle structure using a substrate processing apparatus including: areaction vessel having a tubular shape and provided with a coilinstalled at an outer circumference thereof; a cover installed at afirst end of the reaction vessel; a gas introduction port installed atthe cover; a substrate processing chamber installed at a second end ofthe reaction vessel; and a gas exhaust part connected to the substrateprocessing chamber, the baffle structure comprising: a first plate and asecond plate stacked between the gas introduction port and an upper endof the coil.

<Supplementary Note 5>

A baffle structure using a substrate processing apparatus including: areaction vessel having a tubular shape and provided with a coilinstalled at an outer circumference thereof; a cover installed at afirst end of the reaction vessel; a gas introduction port installed atthe cover; a substrate processing chamber installed at a second end ofthe reaction vessel; and a gas exhaust part connected to the substrateprocessing chamber, the baffle structure including a first plate and asecond plate formed to overlap each other via a space, and having aheight smaller than a distance between the gas introduction port and anupper end of the coil.

1. A substrate processing apparatus comprising: a reaction vessel havinga tubular shape and provided with a coil installed at an outercircumference thereof; a cover installed at a first end of the reactionvessel; a gas introduction port installed at the cover; a first plateinstalled between the gas introduction port and an upper end of thecoil; a second plate installed between the first plate and the upper endof the coil; a substrate processing chamber installed at a second end ofthe reaction vessel; and a gas exhaust part connected to the substrateprocessing chamber.
 2. The substrate processing apparatus according toclaim 1, further comprising an O-ring installed at an outercircumference of a front end of the reaction vessel.
 3. A method ofmanufacturing a semiconductor device using a substrate processingapparatus comprising: a reaction vessel having a tubular shape andprovided with a coil installed at an outer circumference thereof; acover installed at a first end of the reaction vessel; a gasintroduction port installed at the cover; a first plate installedbetween the gas introduction port and an upper end of the coil; a secondplate installed between the first plate and the upper end of the coil; asubstrate processing chamber installed at a second end of the reactionvessel; and a gas exhaust part connected to the substrate processingchamber, the method comprising: inducing a gas introduced through thegas introduction port about the coil via the first and second plates;exciting the gas into a plasma state by the coil and processing thesubstrate placed in the substrate processing chamber with the gas; andexhausting the gas through the gas exhaust part.
 4. A baffle structureused in a substrate processing apparatus comprising: a reaction vesselhaving a tubular shape and provided with a coil installed at an outercircumference thereof; a cover installed at a first end of the reactionvessel; a gas introduction port installed at the cover; a substrateprocessing chamber installed at a second end of the reaction vessel; anda gas exhaust part connected to the substrate processing chamber, thebaffle structure comprising: a first plate and a second plate stackedbetween the gas introduction port and an upper end of the coil.